William R. Eisenstadt

Eisesntadt photo

Professor of Electrical and Computer Engineering, Ph.D.,  Stanford  University, 1986


Prof. Eisenstadt Research Website and Research Group Information

Prof. Eisenstadt University of Florida ECE Department Web Page

Prof. Eisenstadt Google Scholar Profile

Contents

Contact Information

University of Florida

Department of Electrical and Computer Engineering

1064 Center Drive

Room 529 NEB

Gainesville , FL32611-6130

Phone: 352.392.4946

Fax: 352.392.8381

wre@tec.ufl.edu 


 

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Research Information

I have research in the areas of test of analog and mixed signal circuits, design of  on-chip wireless systems, and  IC interconnect and package characterization My recent work  combines electronic design, packaging, and embedded software design for wireless sensor systems in collaboration with leading researchers in entomology (mosquitos, flies, etc.), power systems, and biomedicine.  Current designs and prototypes include microclimate weather stations and wireless temperature sensors for blood monitoring. I am also developing workshops for training industry engineers IC test of analog devices.


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Recent Projects  2010-2015


Tramp Metal Detector Remote Communication Integration, sponsored by Tectron Engineering Company.

Development of Wireless Asian Citrus Psyllid Traps, sponsored by  USDA, CMAVE

Wireless Spot Weather System Technology for Mosquito Control Districts in collaboration with  Mobisoft  Infotech.  

Closed Loop Frequency Control for Tunable High Quality Filter Factors, with Defense Electronics Corporation.

Develop an “in-target” Power Delivery Measurement Capability, with Intel Corporation

GaN Hydrogen Sensor and Biosensor Commercialization Proposal, with UF office of Technology  Licensing and NetScientific Inc

Collaborative Research: Energy Aware Millimeter Wireless Data Communications in Multicore Systems,
with NSF

Chip-Scale Microwave/MM-Wave Instrumentation, an NSF SBIR subcontract with Modelithics, Inc.,


 

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Recent Patents and Publications

2015

Albert Baek, and W. R. Eisenstadt “Design and Techniques for on-Die Power Integrity Noise Measurement System with Digital Output" accepted 2015 IEEE Int'l Symposium on Circuits & Systems, Lisbon, Portugal, May 24-27, 2015.

 

Byul Hur and W. R. Eisenstadt, “Test System, Measurement Uncertainty, and Design of On-chip Six-Port Reflectometers for 5G Applications,” accepted to IEEE ARFTG 85th Microwave Measurement Conference, Phoenix, AZ, May 22, 2015.

 

Byul Hur and W. R. Eisenstadt, “True-Differential/Common-mode Mixed-mode S-parameter Measurement Techniques for Cellular and 4G Bandwidths,” accepted to WAMICON 2015, Cocoa Beach, FL, April 13-15, 2015.

 Krishna C. Mojjada, Dooyoung Kim and W. R. Eisenstadt, “A 6pJ/bit Transmitter Front End in 130nm CMOS Technology for Wireless Interconnect,” WAMICON 2015, Cocoa Beach, FL, April 13-15, 2015.

Byul Hur and W. R. Eisenstadt, “Implementation of the Low-power Wireless Multiple Temperature Sensor Pole for Agriculture and  Mosquito Research,” accepted, IEEE SoutheastCon 2015, Fort Lauderdale, FL, April 9–12, 2015.

 Byul Hur and W. R. Eisenstadt, “Low-Power Wireless Climate Monitor System with RFID security access feature for Mosquito and Pathogen Research,” IEEE MobiSecServ 2015, 19-20 February 2015, Gainesville FL, 2015.

2014

B. Hur and W. R. Eisenstadt, “Tunable Active Directional Couplers,” U.S. Patent 8,704,575, UF#-13618,, Patent Awarded April 22, 2014.

W.R. Eisenstadt and A. Kinsey, “Monitoring System for Perishable or Temperature -Sensitive Product Transportation and Storage," US Provisional Patent Application Docket No. UF.1124P, Serial No. 61/924,845; filed January 8, 2014.

K. C. Mojjada and W. R. Eisenstadt, “Polarization Differential Antenna for LOS Communications in a Multi-Antenna System,” IEEE Transactions on Antennas & Propagation, Vol. 62, No. 6, pp. 3978 – 3984, May 2014,  DOI 10.1109/TAP.2014.2323409.


H. Baek and W.R. Eisenstadt, “Characterization of On-die Power Supply Noise in FCBGA (Flip-Chip Ball Grid Array) Packages,” ECTC 2014, Lake Buena Vista, FL, May 27-30, 2014, 4 pages.

2013


B. Hur and W. R. Eisenstadt, “Tunable Active Directional Couplers,” U.S. Patent 8,704,575, UF#-13618, February 28, 2011. Patent application US 2013/0147535 on June 18, 2012. US, Notice of allowance by patent examiner 12/23/2013.

W. R. Eisenstadt and B. Hur, “Embedded RF test circuits: RF power detectors, RF power control, directional couplers, and 77-GHz-six-port reflectometer,” JICCE, Journal of information and communication convergence engineering, volume 11, issue 1, 2013, Pages 56-61. DOI : 10.6109/jicce.2013.11.1.056, Invited paper


B. Hur and W. Eisenstadt, “Tunable Broadband MMIC Active Directional Coupler,”
IEEE Trans. on Microwave. Theory and Tech., Vol. 61, No. 1, pp. 168 – 176, Jan. 2013, DOI 10.1109/TMTT.2012.2228218.

H. Baek and W. R. Eisenstadt, “Cost effective modeling methodologies and evaluating electrical interaction in FCBGA packages,”
EPEPS, 2013 IEEE 22nd Conference, San Jose, CA, 27-30 Oct. 2013, pp.103 – 106,  DOI: 10.1109/EPEPS.2013.6703476

 
H. Baek and W. R.  Eisenstadt, “Signal integrity characterization of high-speed I/O in 3D chip-package system,” Wireless and Microwave Technology Conference (WAMICON), 2013 IEEE 14th Annual, 7-9 April 2013, pp. 1 – 4, DOI:    10.1109/WAMICON.2013.6572738

H. Baek and W. R. Eisenstadt, “On-chip 20Gbps High-Speed, I/O IC Test System for Signal Integrity Characterization in Flip-Chip Package,” IEEE SoutheastCon,2013, Jacksonville, FL, April 4-7, 2013, pp. 1-6. DOI: 10.1109/SECON.2013.6567499.

K. Mojjada, M-C. Lee, H. Baek, and W.R. Eisenstadt, “Characterization of Embedded RF Elements on a 3D Integrated Circuit,”
Wireless and Microwave Technology Conference (WAMICON), 2013 IEEE 14th Annual, 7-9 April 2013, pp 1-6, DOI: 10.1109/WAMICON.2013.6572729.

2012

H-H. Yeh, K. L. Melde, W. R. Eisenstadt, “Design and packaging of small 60 GHz antenna array for multi-chip communication,  IEEE 2012 ICWITS, Maui, Hawaii, Nov. 11-16, 2012, pp. 1 – 4, DOI 10.1109/ICWITS.2012.6417762.

H. Baek, S. Harb, and W. R. Eisenstadt, “GTL High Speed I/O for TSV and Interconnect Signal Integrity Characterization,”  to The 62nd Electronic Components and Technology Conference, ECTC 2012, San Diego, CA, May 29 – June 1, 2012, pp. 840- 850, DOI - 10.1109/ECTC.2012.6248932.

 

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Biographical Information

I have over 35 years of experience in analog, digital and microwave circuit design and in building product prototypes for commercialization. I have published over 160 refereed conference and journal publications, am an inventor of 16 patents and have advised 24 PhD graduates. Two of my technologies are licensed for commercialization by companies through the University of Florida. 


 
 

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Last revised:  12/17/02