William R. Eisenstadt
Professor of Electrical and Computer Engineering, Ph.D., Stanford University, 1986Prof. Eisenstadt Research Website and Research Group InformationProf. Eisenstadt University of Florida ECE Department Web Page
Prof. Eisenstadt Google Scholar Profile
Department of Electrical and Computer Engineering
Gainesville , FL32611-6130
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I have research in the areas of test of analog and
mixed signal circuits, design of on-chip wireless systems,
interconnect and package characterization.
My recent work combines electronic design,
packaging, and embedded software design for wireless sensor systems in
collaboration with leading researchers in entomology (mosquitos, flies,
power systems, and biomedicine. Current designs and prototypes
include microclimate weather stations and
wireless temperature sensors for blood monitoring. I am also developing
workshops for training industry engineers IC test of analog devices.
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Recent Projects 2010-2015
Metal Detector Remote Communication Integration, sponsored by Tectron Engineering
of Wireless Asian Citrus Psyllid Traps,
sponsored by USDA, CMAVE
Spot Weather System Technology for Mosquito Control Districts
in collaboration with Mobisoft Infotech. Closed
Loop Frequency Control for Tunable High Quality Filter Factors
with Defense Electronics Corporation.Develop
an “in-target” Power Delivery Measurement Capability, with
Hydrogen Sensor and Biosensor Commercialization Proposal
UF office of Technology Licensing and NetScientific Inc
Research: Energy Aware Millimeter Wireless Data Communications in
with NSFChip-Scale Microwave/MM-Wave Instrumentation, an NSF SBIR subcontract with Modelithics, Inc.,
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Recent Patents and Publications
Baek, and W. R. Eisenstadt “Design and Techniques for on-Die Power
Integrity Noise Measurement System with Digital Output" accepted 2015
IEEE Int'l Symposium on Circuits & Systems, Lisbon, Portugal, May
Hur and W. R. Eisenstadt, “Test System, Measurement Uncertainty, and
Design of On-chip Six-Port Reflectometers for 5G Applications,” accepted
to IEEE ARFTG 85th Microwave Measurement Conference, Phoenix,
AZ, May 22, 2015.
Hur and W. R. Eisenstadt, “True-Differential/Common-mode Mixed-mode
S-parameter Measurement Techniques for Cellular and 4G Bandwidths,”
accepted to WAMICON 2015, Cocoa Beach, FL, April 13-15, 2015.
C. Mojjada, Dooyoung Kim and W. R. Eisenstadt, “A 6pJ/bit Transmitter
Front End in 130nm CMOS Technology for Wireless Interconnect,” WAMICON
2015, Cocoa Beach, FL, April 13-15, 2015.
Hur and W. R. Eisenstadt, “Implementation of the Low-power Wireless
Multiple Temperature Sensor Pole for Agriculture and Mosquito Research,” accepted, IEEE
SoutheastCon 2015, Fort Lauderdale, FL, April 9–12, 2015.
Hur and W. R. Eisenstadt, “Low-Power Wireless Climate Monitor System with
RFID security access feature for Mosquito and Pathogen Research,” IEEE
MobiSecServ 2015, 19-20 February 2015, Gainesville FL, 2015.
B. Hur and W. R. Eisenstadt, “Tunable Active
Directional Couplers,” U.S. Patent 8,704,575, UF#-13618,, Patent Awarded April 22, 2014.
W.R. Eisenstadt and A.
Kinsey, “Monitoring System for Perishable or Temperature -Sensitive Product Transportation and Storage," US Provisional Patent Application Docket
No. UF.1124P, Serial No. 61/924,845; filed
January 8, 2014.
Mojjada and W. R. Eisenstadt, “Polarization Differential Antenna for LOS
Communications in a Multi-Antenna System,” IEEE Transactions on
Antennas & Propagation, Vol. 62, No. 6, pp. 3978 – 3984, May 2014,
Baek and W.R. Eisenstadt, “Characterization of On-die Power Supply Noise
in FCBGA (Flip-Chip Ball Grid Array) Packages,” ECTC 2014, Lake Buena
Vista, FL, May 27-30, 2014, 4 pages.
2013B. Hur and W. R. Eisenstadt, “Tunable Active
Directional Couplers,” U.S. Patent 8,704,575, UF#-13618, February 28, 2011. Patent
application US 2013/0147535 on June 18, 2012. US, Notice of allowance by patent
W. R. Eisenstadt and B. Hur, “Embedded RF test
circuits: RF power detectors, RF power control, directional couplers, and
77-GHz-six-port reflectometer,” JICCE, Journal of information and communication
convergence engineering, volume 11, issue 1, 2013, Pages 56-61. DOI :
10.6109/jicce.2013.11.1.056, Invited paper
and W. Eisenstadt, “Tunable Broadband MMIC Active Directional Coupler,” IEEE
Trans. on Microwave. Theory and Tech., Vol. 61, No. 1, pp. 168 – 176, Jan.
2013, DOI 10.1109/TMTT.2012.2228218.
Baek and W. R. Eisenstadt, “Cost effective modeling methodologies and
evaluating electrical interaction in FCBGA packages,” EPEPS, 2013 IEEE
22nd Conference, San Jose, CA, 27-30 Oct. 2013, pp.103 – 106, DOI: 10.1109/EPEPS.2013.6703476
Baek and W. R. Eisenstadt, “Signal
integrity characterization of high-speed I/O in 3D chip-package system,” Wireless
and Microwave Technology Conference (WAMICON), 2013 IEEE 14th Annual,
7-9 April 2013, pp. 1 – 4, DOI:
H. Baek and W. R. Eisenstadt, “On-chip
20Gbps High-Speed, I/O IC Test System for Signal Integrity
Characterization in Flip-Chip Package,” IEEE SoutheastCon,2013, Jacksonville,
FL, April 4-7, 2013, pp. 1-6. DOI: 10.1109/SECON.2013.6567499.
K. Mojjada, M-C. Lee, H. Baek, and W.R.
Eisenstadt, “Characterization of Embedded RF Elements on a 3D Integrated
Circuit,” Wireless and Microwave Technology Conference
(WAMICON), 2013 IEEE 14th Annual, 7-9 April 2013, pp 1-6, DOI: 10.1109/WAMICON.2013.6572729.
H-H. Yeh, K. L. Melde, W. R. Eisenstadt,
“Design and packaging of small 60 GHz antenna array for multi-chip
communication, IEEE 2012 ICWITS,
Maui, Hawaii, Nov. 11-16, 2012, pp. 1 – 4, DOI
H. Baek, S. Harb, and W. R. Eisenstadt,
“GTL High Speed I/O for TSV and Interconnect Signal Integrity
Characterization,” to The 62nd
Electronic Components and Technology Conference, ECTC 2012, San Diego,
CA, May 29 – June 1, 2012, pp. 840- 850, DOI - 10.1109/ECTC.2012.6248932.
I have over 35
years of experience in analog, digital and microwave circuit design and in
building product prototypes for commercialization. I have published
over 160 refereed conference and journal publications, am an inventor of 16
patents and have advised 24 PhD graduates. Two of my technologies are licensed
for commercialization by companies through the University of Florida.
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